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How to set the SMT patch processing quality control point?
Mar 29, 2018

In SMT chip processing, in order to ensure that the process can be performed normally, it is necessary to strengthen the quality inspection of each process, and then monitor its operating conditions. Therefore, it is particularly important to establish quality control points after some critical processes. This can promptly identify the quality problems in the previous processes and correct them, and eliminate substandard products into the next process. The setting of the quality control point is related to the production process flow. We can set the following quality control points in the processing process:

1, PCB incoming material view. Whether the pad is oxidized, whether the printed board is deformed or not, and whether the printed board is scratched or not. Check the method: visually check according to the test specification.

 

2, plug-in view. There are no errors; there are no missing parts; the state of the components of the cartridge; view method: visual inspection according to the test specification.

 

3, solder paste print view. Whether the thickness can be uniform, whether there is bridging, whether there is edge collapse, whether the printing can be thorough, and whether there is any error in the printing; View method: visual inspection according to the test specification or inspection with a magnifying glass.

 

4, after the reflow furnace before viewing. Whether there is no drop; there is no shift; there is no error; component mounting position status; View method: visual inspection according to test specifications or inspection with a magnifying glass.

 

5, view after reflow oven. The welding conditions of the components include the presence or absence of bad solder joints, solder joints, misplacements, solder balls, and false solders. Check the method: visual inspection according to the test specification or inspection with a magnifying glass.

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