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General Requirements For Making PCB Test Points
Mar 04, 2017

General requirements for making PCB test points
Is very difficult to meet all requirements, but meets the requirements, higher quality sheet. A key element needed in designing test points on the PCB Board. Pads for soldering surface mount components do not allow doubles as a test, the test pads must be designed separately to ensure that solder joint inspection and the normal debugging. Pad for testing PCB-arrangement as much as possible on the same side, that is easy to detect, and to reduce testing costs.

The process design requirements
PCB edge test point distance needs to be greater than 5mm;
Test points not covered by solder resist ink or text;
Test point solder plating or the best selection of texture soft, easy to run through, easy oxidation of metal, in order to ensure reliable grounding, extend the life of probe
Test point components needs to be placed around the outside of the 1mm to avoid impact probe and components;
Test points need to placed in the locating hole (with test points used to pinpoint, best non-metallic hole locating hole error shall be within ± 0.05mm) ring around the outside of the 3.2mm;
Test point diameter not less than 0.4mm, the spacing between adjacent test point it is best to 2.54mm above, but not less than 1.27mm;
Testing cannot be placed over the 6.4mm components, excessive Online probe test fixture for measuring components will cause poor contact pilot;
Test distance between points and chip component edge c highly h has the following relationships with the SMD: SMD h ≤ 3mm,C acuity 2mm;SMD height h ≥ 3mm,C ≥ 4mm.
Testing spot weld size, spacing and layout should also match the used test equipment with the relevant requirements.
We hope that through the PCB test, try to improve the quality of the circuit board itself.