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Introduction To SMT Technology Knowledge
Mar 23, 2018

A.SMT technology introduction


Surface Mount Technology (Surfcd Mounting Technolegy referred to as SMT) is a new generation of electronic assembly technology. It compresses traditional electronic components into a device that is only a few tenth of the size of a device, thus achieving a high density and high reliability of electronic product assembly. Miniaturization, low cost, and automation of production. This miniaturized component is called: SMY device (or SMC, chip device). The process of mounting components onto a print (or other substrate) is referred to as the SMT process. Related assembly equipment is called SMT equipment.


At present, advanced electronic products, especially computer and communication electronic products, have generally adopted SMT technology. In the world, the output of SMD devices has been increasing year by year, while the output of traditional devices has been declining year by year. Therefore, with the passage of advances, SMT technology will become more and more popular.


Or say: SMT is the surface mount technology (abbreviation of Surface Mounted Technology), is the most popular technology and process in the electronics assembly industry.


II. What are the characteristics of SMT?


High packing density, small size and light weight of electronic products. The volume and weight of patch components are only about 1/10 that of traditional insertion components. After SMT is generally adopted, the electronic product volume is reduced by 40% to 60% and the weight is reduced by 60%. 80%.


High reliability and strong vibration resistance. The solder joint defect rate is low.


High frequency characteristics. Reduced electromagnetic and radio frequency interference.


Easy to automate and increase productivity. Reduce costs by 30% to 50%. Save on materials, energy, equipment, manpower, and time.


III. Why Use SMT


The pursuit of miniaturization of electronic products, previously used perforated plug-in components can not be reduced;


Electronic products have more complete functions. The integrated circuits (ICs) used have no perforated components, especially large-scale, highly integrated ICs, and have to use surface mount components.


With product batching and production automation, the factory must produce high-quality products at low cost and high output in order to meet customer needs and strengthen market competitiveness;


The development of electronic components, the development of integrated circuits (ICs), and the multiple applications of semiconductor materials;


The electronic science and technology revolution is imperative, chasing international trends.