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What Is DIP Production?
Apr 18, 2018

DIP assembly (Dual In-line Package), also called dual in-line package technology, refers to an integrated circuit chip packaged in a dual in-line package. 

The DIP package with features as below: It is suitable for perforation welding on PCB (Printed Circuit Board) and is easy to operate.The ratio between the chip area and the package area is large, so the volume is also large.

Most small and medium-sized IC components use this type of package. The number generally does not exceed 100. The DIP-packaged CPU chip has two rows of pins that need to be plugged into a chip socket having a DIP structure. 

DIP package structure includes: single-layer ceramic dual in-line DIP, multilayer ceramic dual in-line DIP, lead frame DIP (including plastic encapsulated structure, glass ceramic seal, ceramic low melting glass encapsulated) etc.

Of course, it is also possible to directly solder on the circuit board with the same number of holes and geometric arrangement. DIP-packaged chips should be especially careful when inserting or removing from the chip socket to avoid damaging the pins.